Combinatorial Non-Contact Wet Processing

ABSTRACT

An apparatus and method for combinatorial non-contact wet processing of a liquid material may include a source of a liquid material, a first reaction cell, a second reaction cell, a first plurality of gas jets disposed within an interior of the first reaction cell, the first plurality of gas jets configured to atomize the liquid material transferred to the interior of the first reaction cell, a second plurality of gas jets disposed within an interior of the second reaction cell, the second plurality of gas jets configured to atomize the liquid material transferred to the interior of the second reaction cell, a first vacuum element disposed along a periphery of the first reaction cell, and a second vacuum element disposed along a periphery of the at least a second reaction cell.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Continuation Application of U.S. patent application Ser. No.12/977,306, filed on Dec. 23, 2010, which is herein incorporated byreference for all purposes.

TECHNICAL FIELD

The present invention generally relates to the application of liquidmaterial, and more particularly to the application of a liquid materialutilizing a system and process for non-contact liquid materialapplication onto a substrate.

BACKGROUND

As feature sizes continue to shrink, improvements, whether in materials,unit processes, or process sequences, are continually being sought forthe deposition processes. However, semiconductor companies conduct R&Don full wafer processing through the use of split lots, as thedeposition systems are designed to support this processing scheme. Thisapproach has resulted in ever escalating R&D costs and the inability toconduct extensive experimentation in a timely and cost effective manner.

As an example, integrated circuit (IC) manufacturing typically includesa series of processing steps such as cleaning, surface preparation,deposition, lithography, patterning, etching, planarization,implantation, thermal annealing, and other related unit processingsteps. The precise sequencing and integration of the unit processingsteps enables the formation of functional devices meeting desiredperformance metrics such as speed, power consumption, and reliability.

The drive towards ever increasing performance of devices or systems ofdevices such as in systems on a chip (SOCs) has led to a dramaticincrease in the complexity of process sequence integration and deviceintegration, or the means by which the collection of unit processingsteps are performed individually and collectively in a particularsequence to yield devices with desired properties and performance. Thisincrease in complexity of device integration has driven the need for,and the subsequent utilization of increasingly complex processingequipment with precisely sequenced process modules to collectivelyperform an effective unit processing step.

The ability to process uniformly across an entire monolithic substrateand/or across a series of monolithic substrates is advantageous formanufacturing cost effectiveness, repeatability and control when adesired process sequence flow for IC manufacturing has been qualified toprovide devices meeting desired yield and performance specifications.However, processing the entire substrate can be disadvantageous whenoptimizing, qualifying, or investigating new materials, new processes,and/or new process sequence integration schemes, since the entiresubstrate is nominally made the same using the same material(s),process(es), and process sequence integration scheme. Conventional fullwafer uniform processing results in fewer data per substrate, longertimes to accumulate a wide variety of data and higher costs associatedwith obtaining such data. As an example, traditional liquid chemicaldeposition processes are severely limited in that they typically coat anentire substrate surface with a liquid material. Thus, standard liquidapplication processes used throughout various steps in semiconductorprocessing lack the ability to perform combinatorial liquid materialprocessing and deposition. As a result, the manufacture and analysis ofa substrate region or structure treated with traditional liquid chemicalapplication processes require relatively long processing times andincreased processing steps. Additionally, the inability tosimultaneously apply liquid materials at multiple regions and multiplematerials on a single substrate surface inhibits the ability forcomparative analysis between the various regions of a given substrateand/or substrates.

BRIEF DESCRIPTION OF THE DRAWINGS

The numerous advantages of the disclosure may be better understood bythose skilled in the art by reference to the accompanying figures inwhich:

FIG. 1A is a glancing angle schematic view of a system for combinatorialnon-contact wet processing, in accordance with one embodiment of thepresent invention.

FIG. 1B is a simplified schematic view of a system for combinatorialnon-contact wet processing, in accordance with one embodiment of thepresent invention.

FIG. 1C is a simplified schematic view of a system for combinatorialnon-contact wet processing, in accordance with one embodiment of thepresent invention.

FIG. 1D is a simplified schematic view of a system for combinatorialnon-contact wet processing, in accordance with one embodiment of thepresent invention.

FIG. 1E is a block diagram illustrating an implementation ofcombinatorial processing and evaluation.

FIG. 1F is a simplified schematic view of a reaction cell assembly ofthe system for combinatorial non-contact wet processing, in accordancewith one embodiment of the present invention.

FIG. 1G is a schematic view of a single reaction cell of the system forcombinatorial non-contact wet processing, in accordance with oneembodiment of the present invention.

FIG. 1H is a simplified schematic view of a single reaction cell of thesystem for combinatorial non-contact wet processing illustrating avacuum element, in accordance with one embodiment of the presentinvention.

FIG. 2 is a simplified schematic view of a reaction cell assembly of thesystem for combinatorial non-contact wet processing illustrating a gascurtain element, in accordance with one embodiment of the presentinvention.

FIG. 3A is a simplified schematic view of a single reaction cell of thesystem for combinatorial non-contact wet processing illustrating ashowerhead device, in accordance with one embodiment of the presentinvention.

FIG. 3B is a glancing angle schematic view of a showerhead device, inaccordance with one embodiment of the present invention.

FIG. 4A is a simplified schematic view of a horizontal reaction cellassembly of the system for combinatorial non-contact wet processing, inaccordance with one embodiment of the present invention.

FIG. 4B is a simplified schematic view of a horizontal reaction cellassembly of the system for combinatorial non-contact wet processing, inaccordance with one embodiment of the present invention.

FIG. 5 is a flow chart illustrating a method for combinatorialnon-contact wet processing.

DETAILED DESCRIPTION OF THE INVENTION

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not necessarily restrictive of the invention as claimed. Theaccompanying drawings, which are incorporated in and constitute a partof the specification, illustrate embodiments of the invention andtogether with the general description, serve to explain the principlesof the invention. Reference will now be made in detail to the subjectmatter disclosed, which is illustrated in the accompanying drawings.

Referring generally to FIG. 1A through 4B, a system 100 forcombinatorial non-contact wet processing is described in accordance withthe present disclosure. The system 100 for combinatorial non-contact wetprocessing may include multiple reaction cells 102 each of which arecapable of isolating a selected region 108 of a substrate 114. Theisolating non-contact reaction cells 102 may be utilized to apply aselected liquid material onto the selected isolated regions 108 of thesurface of a substrate 114. The two or more isolating reaction cells 102may be used combinatorially in order to deposit materials simultaneouslyor sequentially at two or more isolated substrate regions 108. Thesystem 100 for combinatorial non-contact wet processing provides for theapplication of multiple materials in discretized regions 108 at selectedpositions on the surface of a given substrate 114, such as a siliconwafer. Moreover, the system 100 for combinatorial non-contact wetprocessing allows for the application of liquid materials to a substratesurface without the added contamination associated to a mechanicallyattached reaction cell. Non-contact spray deposition is particularlyadvantageous in settings where the pristine nature of an underlyingsubstrate is critical.

The embodiments described herein enable the application of combinatorialtechniques to deposition process sequence integration in order to arriveat a globally optimal sequence of semiconductor manufacturing operationsby considering interaction effects between the unit manufacturingoperations on multiple regions of a substrate concurrently.Specifically, multiple process conditions may be concurrently employedto effect such unit manufacturing operations, as well as materialcharacteristics of components utilized within the unit manufacturingoperations, thereby minimizing the time required to conduct the multipleoperations. A global optimum sequence order can also be derived and aspart of this technique, the unit processes, unit process parameters andmaterials used in the unit process operations of the optimum sequenceorder are also considered.

The embodiments described herein are capable of analyzing a portion orsub-set of the overall deposition process sequence used to manufacture asemiconductor device. The process sequence may be one used in themanufacture of integrated circuits (IC) semiconductor devices, datastorage devices, photovoltaic devices, and the like. Once the subset ofthe process sequence is identified for analysis, combinatorial processsequence integration testing is performed to optimize the materials,unit processes and process sequence for that portion of the overallprocess identified. During the processing of some embodiments describedherein, the deposition may be used to form, modify, or completestructures already formed on the substrate, which structures areequivalent to the structures formed during manufacturing of substratesfor production. For example, structures on semiconductor substrates mayinclude, but are not limited to, trenches, vias, interconnect lines,capping layers, masking layers, diodes, memory elements, gate stacks,transistors, or any other series of layers or unit processes that createa structure found on semiconductor chips. The material, unit process andprocess sequence variations may also be used to create layers and/orunique material interfaces without creating all or part of an intendedstructure, which allows more basic research into properties of theresulting materials as opposed to the structures or devices createdthrough the process steps. While the combinatorial processing variescertain materials, unit processes, or process sequences, the compositionor thickness of the layers or structures or the action of the unitprocess is preferably substantially uniform within each region, but canvary from region to region per the combinatorial experimentation.

The result is a series of regions on the substrate that containstructures or results of unit process sequences that have been uniformlyapplied within that region and, as applicable, across different regionsthrough the creation of an array of differently processed regions due tothe design of experiment. This process uniformity allows comparison ofthe properties within and across the different regions such that thevariations in test results are due to the varied parameter (e.g.,materials, unit processes, unit process parameters, or processsequences) and not the lack of process uniformity. However, non-uniformprocessing of regions can also be used for certain experiments of typesof screening. Namely, gradient processing or regional processing havingnon-uniformity outside of manufacturing specifications may be used incertain situations.

The term “combinatorial processing” generally refers to techniques ofdifferentially processing multiple regions of a substrate. Combinatorialprocessing can be used to produce and evaluate different materials,chemicals, processes, and techniques related to semiconductorfabrication as well as build structures or determine how the above coat,fill, or interact with existing structures. Combinatorial processingvaries materials, unit processes and/or process sequences acrossmultiple regions on a substrate.

FIGS. 1A through 1D illustrate schematic views of a system 100 forcombinatorial non-contact wet processing in accordance with exemplaryembodiments of the present invention. The system 100 for combinatorialnon-contact wet processing may include two or more reaction cells 102configured to isolate two or more selected regions 108 of a substrate114. As shown in FIG. 1A, the reaction cells 104 may be arranged in anarray (e.g., hexagonal array), allowing for the precise control of thelocation of the isolated application regions 108 on a correspondingsubstrate 114 surface. Moreover, the system 100 may include one or moreliquid material sources 106 suitable for supplying a liquid material 107to the reaction cells 102. For instance, one or more liquid materialsources 106 may be in fluidic communication with one or more reactioncells 102 of the system 100, allowing for the transportation of one ormore liquid materials 106 from the liquid material source 107 to thereaction cells 102.

In one embodiment, illustrated in FIG. 1B, the system 100 may include asingle liquid material source 106 fluidically coupled to two or morereaction cells 102. For example, a single liquid material 107 may betransported from a liquid material source 106 to two or more reactioncells 104 via a network of liquid source-cell conduits 105. Forinstance, a first portion of the liquid material 106 may be transportedto a first non-contact reaction cell 102 configured to isolate a firstregion 108 of the substrate 114, a second portion of the liquid material106 may be transported to a second non-contact reaction cell 102configured to isolate a second region 108 of the substrate 114, and anNth portion of the liquid material 106 may be transported to an Nthnon-contact reaction cell 102 configured to isolate an Nth region 108 ofthe substrate 114.

In another embodiment, illustrated in FIG. 1C, the system 100 mayinclude two or more liquid sources 106, wherein each liquid source 106is fluidically coupled to a reaction cell 102. For example, a firstliquid material source 106 may be fluidically coupled to a firstreaction cell 102, a second liquid material source 106 may befluidically coupled to a second reaction cell 102, and up to anincluding an Nth liquid material source 106 may fluidically coupled toan Nth reaction cell 102. A portion of the first liquid material 107 maythen be transported from the first liquid material source 106 to a firstreaction cell 102. A portion of the second liquid material 107 may thenbe transported from the second liquid material source 106 to a secondreaction cell 102. A portion of the Nth liquid material 107 may then betransported from the Nth liquid material source 106 to the Nth reactioncell 102. For instance, the portion of the first liquid material 107 maybe transported to a first reaction cell 102 configured to isolate afirst region 108 of the substrate 114, the portion of the second liquidmaterial 107 may be transported to a second reaction cell 102 configuredto isolate a second region 108 of the substrate 114, and the portion ofthe Nth liquid material 107 may be transported to an Nth reaction cell102 configured to isolate an Nth region 108 of the substrate 114. Itshould be noted that the first, second, and up to and including the Nthliquid materials 107 may be comprised of the same or different liquidmaterials.

In another embodiment, illustrated in FIG. 1D, the system 100 mayinclude two or more liquid sources 106, wherein the liquid sources 106are configured to deliver two or more liquid materials 107 to a singlereaction cell 102. For instance, a portion of the first liquid material107, a portion of the second liquid material 107, and up to andincluding a portion of an Nth liquid material 107 may be intermixed. Forinstance, a first liquid material 107, provided from a first liquidsource 106, and second liquid material 107, from a second liquid source106, may be mixed within a source-cell conduit 105 while the liquids aretransported to one or more reaction cells 102. In another instance, afirst liquid material 107, provided from a first liquid source 106, andsecond liquid material 107, from a second liquid source 106, may bemixed in an associated mixing chamber. The mixed liquid material maythen be supplied to one or more reaction cells 102 as described in thepresent disclosure. The preceding description should not be interpretedas a limitation but rather merely an illustration of combinatorialprocessing techniques which may be implemented with the presentlydisclosed system and methods as it is contemplated that a variety ofimplementations may be more or less suitable in different contexts.

FIG. 1E is a block diagram 140 illustrating an implementation ofcombinatorial processing and evaluation. The schematic diagram 140illustrates that the relative number of combinatorial processes run witha group of substrates decreases as certain materials and/or processesare selected. Generally, combinatorial processing includes performing alarge number of processes and materials choices during a first screen,selecting promising candidates from those processes, performing theselected processing during a second screen, selecting promisingcandidates from the second screen, and so on. In addition, feedback fromlater stages to earlier stages can be used to refine the successcriteria and provide better screening results.

For example, thousands of materials are evaluated during a materialsdiscovery stage 142. Materials discovery stage 142 is also known as aprimary screening stage performed using primary screening techniques.Primary screening techniques may include dividing wafers into regionsand depositing materials using varied processes. The materials are thenevaluated, and promising candidates are advanced to the secondaryscreening stage (i.e., the materials and process development stage 144).Evaluation of the materials is performed using metrology tools such asphysical and electronic testers and imaging tools.

The materials and process development stage 144 may evaluate hundreds ofmaterials (i.e., a magnitude smaller than the primary stage) and mayfocus on the processes used to deposit or develop those materials.Promising materials and processes are again selected, and advanced tothe tertiary screening stage (i.e., the process integration stage 146),where tens of materials and/or processes and combinations are evaluated.The tertiary screening stage, or process integration stage 146, mayfocus on integrating the selected processes and materials with otherprocesses and materials into structures.

The most promising materials and processes from the tertiary screeningstage are advanced to the device qualification stage 148. In the devicequalification stage 148, the materials and processes selected areevaluated for high volume manufacturing, which normally is conducted onfull wafers within production tools, but need not be conducted in such amanner. The results are evaluated to determine the efficacy of theselected materials, processes, and integration. If successful, the useof the screened materials and processes can proceed to the manufacturingstage 150.

The schematic diagram 140 represents an example of various techniquesthat may be used to evaluate and select materials, processes, andintegration for the development of semiconductor devices. Thedescriptions of primary, secondary, etc. screening and the variousstages 142-150 are arbitrary and the stages may overlap, occur out ofsequence, be described and be performed in many other ways.

While the preceding description is directed at the implementation ofmultiple reaction cells 102 in accordance with the present invention,the following description will, in part, describe aspects of a singlereaction cell assembly 101. It is contemplated that the followingdescription of components and implementations within the context of asingle reaction cell assembly 101 should be interpreted to extend to themultiple reaction cell configuration of the preceding description.

FIG. 1F illustrates a partial cross-sectional schematic view of a singlereaction cell assembly 101 of the system 100 for combinatorialnon-contact wet processing in accordance with an exemplary embodiment ofthe present invention. The single assembly 101 of the system 100 mayinclude a liquid material source 106 configured to supply a selectedamount of a liquid material 107 to a non-contact reaction cell 102. Theliquid material source 106 may be placed in fluidic communication withthe non-contact reaction cell 102 utilizing a source-cell conduit 104.The liquid material 107 may be transported from the liquid source 106 toan inlet 116 of the non-contact reaction cell 102 through thesource-cell conduit 104.

In addition, the single assembly 101 of the system 100 may include aplurality of gas jets 110 disposed within the interior 132 of thenon-contact reaction cell 102. The gas jets 110 may be used to atomize aportion of the liquid material 107 transported from the liquid materialsource 106 to the inlet 116 of the reaction cell via the source-cellconduit 104 into a spray of liquid material 122. For instance, one ormore gas streams 120 emanating from one or more gas jets 110 may beimpinged onto one or more liquid droplets 118 which enter the interior132 of the deposit cell 102 through the cell inlet 116.

Moreover, the non-contact reaction cell 102 of the assembly 101 may beconfigured to direct the spray of the liquid material 107 from the inlet116 of the reaction cell 102 onto an isolated region 108 of the surfaceof a substrate 114. The reaction cell 102 may be situated such that thenon-contact reaction cell 102 is in close proximity to but not inphysical contact with the surface of the substrate, allowing for thedeposition of spray of liquid material 122 onto an isolated selectedregion 108 of the substrate 114. For instance, the reaction cell 102 maybe positioned at a selected distance above the surface of the substrate114, wherein the selected distance is a function of both the materialproperties of the implemented liquid material and the substrate surface.After atomization by the gas jets 110, the droplets of the spray ofliquid material 122 may accelerate (e.g., via gravitational forces) fromthe top of the reaction cell 102 to the surface of the substrate 114.

Furthermore, the single assembly 101 of the system 100 may include oneor more vacuum elements 127 disposed along an edge of the non-contactreaction cell 102. The vacuum elements 127 may facilitate the flow ofthe liquid spray 122 toward the surface of the substrate 114. Inaddition, the vacuum elements 127 may act to contain the depositedliquid material 111 within a selected region 108 of the substrate 114 byevacuating portions of the liquid material 111 that migrate toward theedge of the region 108 demarked by the vacuum element(s) 127.

In some embodiments, the region 108 may include one region and/or aseries of regular or periodic regions pre-formed on the substrate. Theregion may have any convenient shape (e.g., circular shape, rectangularshape, elliptical shape, wedge-shaped, or the like). In thesemiconductor field, a region may include, but is not limited to, a teststructure, a single die, a multiple die, a portion of a die, a definedportion of a substrate, or an undefined area of a blanket substrate,which is defined through the processing.

In some embodiments, the system 100 for combinatorial non-contact wetprocessing may include one or more liquid flow control systems 112. Aliquid flow control system 112 may be utilized to control the flow of aliquid material 107 from a liquid source 106 to one or more non-contactreaction cells 102 of the system 100. For example, in a single assembly101 of the system 100, a liquid flow control system 112 may control theflow of a liquid material 107 from a liquid material source 106 to aninlet 116 of the non-contact reaction cell 102 through a source-cellconduit 104, such as a plastic tubing (e.g., polyvinyl chloride tubingor polyethylene tubing) conduit or a metal tubing conduit (e.g.,aluminum tubing, copper tubing, or brass tubing).

In additional embodiments, one or more liquid flow control systems 112may include one or more actuated valves configured to control the flowof a liquid material 107 from a liquid source 106 to one or morereaction cells 102. For example, an actuated valve of the liquid controlsystem 112 may be opened allowing a liquid material 107 to flow from aliquid material source 106 (e.g., pressurize liquid material source) toa liquid inlet of a reaction cell 102. By way of another example, anactuated valve of the liquid control system 112 may be closed, stoppingthe liquid material 107 from flowing from a pressurized liquid materialsource 106 to the liquid inlet of a reaction cell 102.

In another embodiment, one or more liquid flow control systems 112 mayinclude one or more pumps. For example, a pump of the liquid controlsystem 112 may be used to transport the liquid material 107 from theliquid material source 106 to the liquid inlet of the reaction cell 102.For instance, the pump may include a liquid pump used to pump the liquidmaterial 107 from the liquid material source 106 to a liquid inlet ofthe reaction cell 102. In another instance, the pump may include a gaspump used to pressurize a sealed container of the liquid material 107.

In a further embodiment, one or more liquid control systems 112 mayinclude one or more computer control systems. For example, a computercontrol system of the liquid control system 112 may be used to controlone or more valves or one or more pumps of a liquid control system 112.Moreover, it is further contemplated that a computer control system mayinclude preprogrammed software suitable for providing instructions tothe computer system output, which in turn signals the one or moreactuated valves or pumps of a liquid control system 112. Additionally,the computer control system 112 may be responsive to an operator input,wherein the computer control system in response to the operator inputprovides instructions to the computer system output, which in turnsignals the one or more actuated valves or pumps of the liquid controlsystem 112. Further, it is also contemplated that the computer controlsystem 112 may be responsive to a signal transmitted by another controlsystem (e.g., a global control system) of the system 100, wherein thecomputer control system of the liquid control system 112, responsive toa signal from another control system, provides instructions to thecomputer system output, which in turn signals the one or more actuatedvalves or pumps of the liquid control system 112.

It is further contemplated that a global liquid control system may beused to control individual liquid flows in the single assemblies 101 ofthe system 100. For example, a global liquid control system may beutilized to control a first liquid flow from a first liquid materialsource 106 to a first reaction cell 102, a second liquid flow from asecond liquid material source 106 to a second reaction cell 102, and aup to and including an Nth liquid flow from an Nth liquid materialsource 106 to an Nth reaction cell 102.

The preceding description of the one or more liquid control systems 112should not be interpreted as a limitation but rather merely anillustration as it is contemplated that a variety of implementations maybe more or less suitable in different contexts.

In some embodiments, the system 100 for combinatorial non-contact wetprocessing may include one or more gas flow control systems 152. A gasflow control system 152 may be utilized to control the rate at which agas is supplied from a gas source 154 to the gas jets 110 disposed in anon-contact reaction cell 102. For example, in a single assembly 101 ofthe system 100, one or more gas flow control systems 152 may include oneor more actuated valves configured to regulate the gas flow 156 betweena gas source 154 and gas jet 110. The regulation of gas flow 156 betweenthe gas source 154 and the gas jet 110 allows for control of theatomization process of the liquid material 106 in the reaction cell 102.For example, an actuated gas valve of the gas flow control system 152may be adjusted in order to adjust the flow rate of the gas stream 156flowing from the gas source 154 to the gas jets 110 and in turnregulating the conversion of the liquid material 106 to a liquid spraymaterial 122.

In other embodiments, one or more gas flow control systems 152 of thesystem 100 for combinatorial non-contact wet processing may include oneor more electronic mass flow control systems. For example, a mass flowcontrol system of the gas flow control system 152 may be adjusted inorder to adjust the flow rate of the gas stream 156 flowing from the gassource 154 to the gas jets 110 disposed in a non-contact reaction cell102.

In some embodiments, one or more gas flow control systems 152 of thesystem 100 for combinatorial non-contact wet processing may include oneor more actuated orifices. For example, an actuated orifice 129 of a gasflow control system 152 may be utilized to adjust the flow rate of thegas stream 156 flowing from the gas source 154 to the gas jets 110disposed in a non-contact reaction cell 102.

In further embodiments, one or more gas flow control systems 152 mayinclude a computer control system configured to control the actuatedvalves of a gas flow control system 152. For instance, in response to aninput instruction from an operator, the computer control system maytransmit an electronic signal to one or more actuated valves or a massflow control system configured to respond (e.g., open or close) to anelectronic signal. In another instance, a preprogrammed computer controlsystem may maintain or establish a selected gas flow rate by adjustingone or more actuated valves or one or more mass flow control systemslocated between the gas source 154 and the gas jets 110 disposed in anon-contact reaction cell 102.

Further, one or more gas flow control systems 152 may be controlled bythe liquid flow control system 112. For instance, the computer controlsystem of a liquid flow control system 112 may transmit instructionsignals to one or gas flow control system 152 in order to regulate theflow rate of a gas being transported from a gas source 154 to the gasjets 110 disposed in a non-contact reaction cell 102.

It is further contemplated that the computer control system of a gasflow control system 152 may be responsive to a global control system,which is configured to control the various subsystems (e.g., liquidcontrol system(s) 112, gas flow control system(s) 152, or vacuum elementsystems(s) 127) of the system 100. Moreover, it is further recognizedthat the computer control system of one or more liquid flow controlsystems 112 and the computer control system of one or more of the gasflow control systems 152 may in fact be subsystems of a single globalcomputer control system, wherein the computer control system of theliquid flow control system 112 and the computer control system of thegas flow control system 152 are modules of the global computer controlsystem.

It is further contemplated that a global gas flow control system may beused to control individual gas flow rates in the single assemblies 101of the system 100. For example, a global gas flow control system may beutilized to control a first gas flow from a first gas source 154 to thegas jets 110 of a first reaction cell 104, a second gas flow from asecond gas source 154 to a second reaction cell 102, and a up to andincluding an Nth gas flow from an Nth gas source to an Nth reaction cell102. The preceding description of the one or more gas flow controlsystems 152 should not be interpreted as a limitation but rather merelyan illustration as it is contemplated that a variety of implementationsmay be more or less suitable in different contexts.

In some embodiments, one or more source-cell conduits 104 of the system100 may include a laminar flow element. For example, a source-cellconduit 104 may include a straight pipe section configured to producesubstantially laminar flow in the liquid flow 113 between the liquidsource 106 and the reaction cell 102. It should be appreciated by thoseskilled in the art that the non-turbulent laminar flow that may occur ina source-cell conduit 104 may allow for more precise control ofapplication conditions as the fluid movement of the liquid flow 113 ismore readily predicted and controlled.

It is further contemplated that in the context of the system 100 forcombinatorial non-contact wet processing multiple source-cell conduits104 may be implemented. For example, as shown in FIG. 1B, the conduits104 may be used to fluidically couple a single liquid material source106 to multiple reaction cells 102. In another example, as shown in FIG.1C, a conduit 104 may be used to couple a single liquid material source106 to a single reaction cell 102. Further, as shown in FIG. 1D, anetwork of conduits 104 may be implemented to fluidically coupleemerging liquid flows 113 from multiple liquid material sources 106,allowing the combined intermixed liquid flow 113 to be transported tothe individual reaction cells 102 of the system 100.

In some embodiments, the material used to fabricate one or more reactioncells 102 of the system 100 for combinatorial non-contact wet processingmay include, but is not limited to, a metal material or a plasticmaterial. For example, a reaction cell 102 of the system 100 forcombinatorial non-contact wet processing may include an aluminumreaction cell. By way of another example, a reaction cell 102 of thesystem 100 for combinatorial non-contact wet processing may include aTeflon reaction cell. In another example, a reaction cell 102 of thesystem 100 for combinatorial non-contact wet processing may include anacrylic reaction cell. An acrylic reaction cell is particularlyadvantageous when optical monitoring of the spray deposition process orsubsequent treatment processes are required. Further, ultraviolet (“UV”)transparent acrylic may be implemented in situations where the depositedliquid material 111 of liquid material spray 122 requires further UVtreatment (e.g., UV curing).

A variety of reaction cell 102 shapes may be implemented in accordancewith the present invention. For example, the reaction cell 102 mayinclude a cylindrical shaped reaction cell, as illustrated in FIGS. 1Athrough 1F. In another example, the reaction cell 102 may include arectangular shaped reaction cell, as illustrated in FIGS. 4A and 4B. Ina general sense, the reaction cell 102 may be of any convenient shape(e.g., cylinder, rectangular cuboid, a cone, a pyramid, and the like)and may depend on the specifics of its implementation.

A variety of substrates may be implemented in accordance with thepresent invention. For example, the substrate 114 may include, but isnot limited to, a silicon substrate, a gallium arsenide substrate,glass, quartz, ruby or the like. The preceding lists of substratematerials should not be considered a limitation as there exists avariety of substrate materials suitable for implementation in accordancewith the present invention. In a general sense, a substrate should beinterpreted as any object with which a thin film material may bedeposited utilizing the present invention.

Further, the substrate 114 may be a conventional round 200 millimeter,300 millimeter or any other larger or smaller substrate/wafer size. Inother embodiments, substrate 114 may be a square, rectangular, or othershaped substrate. One skilled in the art will appreciate that substrate114 may be a blanket substrate, a coupon (e.g., partial wafer), or evena patterned substrate having predefined regions. In another embodiment,substrate 114 may have regions defined through the processing describedherein.

Referring now to FIG. 1H, one or more vacuum elements 127 of the system100 may be fluidically coupled to a vacuum trap 134. For example, avacuum element 127 of a reaction cell 102 of a single assembly 101 ofthe system 100 may be utilized to transport coalesced liquid material106 deposited on the substrate 114 from the interior 132 of the reactioncell 102 to a vacuum trap 134. It should also be recognized that thepressure differential created by the vacuum trap 134 may also act toaccelerate the spray of liquid material 122 from the inlet 116 of thereaction cell 102 to the substrate 114 surface.

In a further embodiment, a vacuum element 127 of a reaction cell 102 mayinclude one or more exhaust ports 124 configured to allow for theevacuation of liquid material 107 from the inner region 132 of thereaction cell 102 to the external vacuum trap 134. For example, anexhaust port 124 may be located on the wall 128 of a reaction cell 102and may be fluidically coupled to the vacuum trap 134 via a cell-trapconduit 136, such as plastic (e.g., polyethylene or polyvinyl chloride)tubing or metal (e.g., stainless steel, copper, aluminum, or brass)tubing.

Further, a vacuum element 127 of a reaction cell 102 may include one ormore exhaust channels 126. For example, an exhaust channel 126 of areaction cell 102 may be defined by a wall 128 located within theinterior of a reaction cell 102 and extending from the top of thereaction cell 102 towards the bottom of the reaction cell 102. A vacuumelement inlet 129 at the bottom of the reaction cell 102 allows liquidmaterial 107 to pass from the surface of the substrate 114 to theexhaust channel 126 of the reaction cell 102. Moreover, the exhaustchannel 126 acts to transport the liquid material 107 from the vacuumelement inlet 129 to the exhaust port 124 of the reaction cell 102. Itshould be recognized that the preceding description pertaining to thevacuum element(s) 127 of a single assembly 101 of the system 100 forcombinatorial non-contact wet processing should not be interpreted as alimitation but merely as an illustration as other exhaust systemarrangements may be more or less suitable in different contexts.

In a further embodiment, a vacuum element 127 may include one or moreactuated valves fluidically coupled to an exhaust port 124 of a reactioncell 102 and a vacuum trap 134. For instance, one or more actuatedvalves may be connected in series between the exhaust port 124 and thevacuum trap 134 along the cell-trap conduit 136.

In another embodiment, a vacuum element 127 may include one or moreactuated orifices fluidically coupled to an exhaust port 124 of areaction cell 102 and a vacuum trap 134. For instance, one or moreactuated orifices (e.g., pressure activated orifice) may be connected inseries between the exhaust port 124 and the vacuum trap 134 along thecell-trap conduit 136.

In a further embodiment, one or more vacuum elements 127 may include acomputer control system configured to control the actuated valves oractuated orifices of the one or more vacuum elements 127. For instance,in response to an input instruction from an operator, the computercontrol system may transmit an electronic signal to one or more actuatedvalves or one or more orifices configured to respond to an electronicsignal. In another instance, a preprogrammed computer control system maymaintain or establish a selected liquid uptake rate by adjusting one ormore actuated valves or one or more actuated orifices located betweenthe exhaust port 124 and the vacuum trap 134. It is further contemplatedthat the computer control system may be responsive to a global controlsystem, which is configured to control the various subsystems (e.g.,liquid control system 112, gas flow control system 152, or vacuumelements 127) of the system 100.

In some embodiments, one or more vacuum elements 127 may include a ringshaped vacuum element. For example, as illustrated in FIGS. 1F through1H, a circular shaped vacuum element may be disposed on thecircumference of a cylindrically shaped reaction cell 102. In otherembodiments, one or more vacuum elements 127 may include a bar shapedvacuum element. For example, as illustrated in FIGS. 4A and 4B, a barshaped vacuum element may be disposed along one or more edges of arectangular shaped reaction cell 102. The preceding description of theone or more vacuum elements 127 should not be interpreted as alimitation but rather merely an illustration as it is contemplated thata variety of implementations may be more or less suitable in differentcontexts. Moreover, the specific shape of a given vacuum element 127 maygreatly depend on the geometry of the implement reaction cell 102.

Referring now to FIG. 2, the system 100 for combinatorial non-contactwet processing may include one or more gas curtain elements 202configured to contain the applied liquid material 107 within a selectedregion 108 of the substrate 114. For example, a gas curtain element 202may flow a gas stream 204 at the periphery of a reaction cell 102 inorder to contain the applied liquid material 107 within the selectedregion 108 of the substrate 114. For instance, a curtain gas source 206may supply gas to a gas curtain element 202. The gas curtain element maythen flow one or more gas streams 204 at the bottom edge of the reactioncell 102, directing the gas stream toward the vacuum element inlet 129,in order to contain the applied liquid material 107 within the selectedregion 108 of the surface of the substrate 114. It will be recognized bythose skilled in the art that the requisite flow rate of the utilizedgas curtain stream 204 will be a function of the cell-substratedistance, the type of liquid material 107, and the type of substratesurface.

In some embodiments, the curtain gas source may include an inert gassource. For example, the gas source may include a nitrogen gas source oran argon gas source. For instance, a nitrogen gas source 206 may supplygas to a gas curtain element 202. The gas curtain element may then flowone or more nitrogen gas streams 204 at the bottom edge of the reactioncell 102, directing the nitrogen gas stream toward the vacuum elementinlet 129, in order to contain the deposited liquid material 107 withinthe selected region 108 of the surface of the substrate 114.

In some embodiments, a gas curtain element 202 may include a ring shapedgas curtain element. For example, as illustrated in FIG. 2, a circularshaped vacuum element may be disposed on the circumference of acylindrically shaped reaction cell 102. In other embodiments, one ormore gas curtain elements 202 may include a bar shaped gas curtainelement 406. For example, as illustrated in FIGS. 4A and 4B, a barshaped gas curtain element 406 may be disposed along one or more edgesof a rectangular shaped reaction cell 102. The preceding description ofthe one or more gas curtain elements 202 should not be interpreted as alimitation but rather merely an illustration as it is contemplated thata variety of implementations may be more or less suitable in differentcontexts. Moreover, the specific shape of a given gas curtain element202 may greatly depend on the geometry of the implemented reaction cell102.

Referring now to FIGS. 3A and 3B, the system 100 for combinatorialnon-contact wet processing may include one or more showerhead devices302 disposed within in the interior 132 of the non-contact reaction cell102. A showerhead device 302 may be utilized to improve the uniformspatial distribution of the droplets of the spray of liquid material 122by acting to diffuse the liquid material 107 into a spray of liquidmaterial 122. For example, in a single assembly 101 of the system 100, aliquid material 107 may be transported from a liquid source 106 to ashowerhead device 302 fluidically coupled to the inlet 116 of thereaction cell 102 and disposed within the reaction cell 102. The liquidmaterial 107 may then pass through the openings 304 of the showerheaddevice 302, which act to diffuse the liquid material 107. After passingthrough the showerhead device 302, liquid spray 122 may then flow fromthe showerhead device 302 to the surface of a substrate 114. It isfurther recognized that the showerhead device may be implemented inconjunction with a plurality of gas jets 110, wherein the energyimparted by the gas stream of the gas jets act to further atomize thediffused liquid material.

In a further embodiment, a showerhead device 302 may be arrangedsubstantially parallel to the substrate 114 surface and may be locatedwithin an interior 132 of a reaction cell 102. For example, in a singleassembly 101 of the system 100, the liquid material 107 may betransported from a liquid source 106 to the inlet 116 of a reaction cell102 through a source-cell conduit 104. After entering the interior ofthe reaction cell 132, the liquid material may then pass through theshowerhead device 302, aligned substantially parallel with the surfaceof the substrate 114. The showerhead device 302 may act to diffuse theliquid material 107 prior to deposition onto the substrate 114 surface.Upon emerging from the showerhead device 302, the spray of liquidmaterial 122 may follow a path substantially perpendicular with respectto the substrate 114 (i.e., path is substantially vertical) before beingdeposited onto the surface of the substrate 114.

In another embodiment, one or more showerhead devices 302 may include aninlet configured to directly fluidically couple the showerhead device302 to a source-cell conduit 104. For example, the liquid material 107may be transported from the liquid source 107 to the inlet of ashowerhead device 302 through a source-cell conduit 104. The showerheaddevice 302 may be arranged to effectively function as the inlet of areaction cell 102. After entering the inlet of the showerhead device 302and then passing through the openings 304 of the showerhead device 302,the liquid spray 122 may enter the interior 132 of the reaction cell102. After entering the interior 132 of the reaction cell 102, the sprayof material 122 may follow a path substantially perpendicular withrespect to the substrate (i.e., path is substantially vertical) beforebeing deposited onto the surface of the substrate 114.

In some embodiments, one or more showerhead devices 302 may include adisk shaped showerhead device 302 having a plurality of openings 304configured to transport the liquid material 107 from the liquid source106 side of the showerhead device 302 to the substrate side of theshowerhead device 302. It should be appreciated that a variety ofshowerhead device 302 arrangements may be suitable for implementation incontext of the present invention. For instance, the exact number andarrangement of showerhead device openings 304 may depend on the specificapplication in question.

In some embodiments, one or more showerhead devices 302 may include ametal showerhead device 302. For example, a showerhead head device 302may include, but is not limited to, an aluminum showerhead device, abrass showerhead device, or a stainless steel showerhead device. Forexample, in a single assembly 101 of the system 100, a liquid material107 may be transported from the liquid source 106 to an aluminumshowerhead device. The liquid material 107 may then pass through theopenings 304 of the aluminum showerhead device 302. After passingthrough the aluminum showerhead device 302, the diffused liquid materialspray 122 may then flow from the aluminum showerhead device 302 to thesurface of the substrate 114, where the liquid spray 122 may bedeposited on the substrate 114 surface.

In some embodiments, one or more showerhead devices 302 may include aplastic showerhead device 302. For example, a showerhead head device 302may include, but is not limited to, a polyvinyl chloride (PVC)showerhead device or a polytetrafluoroethylene (PTFE) showerhead device.For example, in a single assembly 101 of the system 100, a liquidmaterial 107 may be transported from the liquid source 106 to PVCshowerhead device. The liquid material 107 may then pass through theopenings 304 of the PVC showerhead device 302. After passing through thePVC showerhead device 302, the diffused liquid material spray 122 maythen flow from the PVC showerhead device 302 to the surface of thesubstrate 114, where the liquid spray 122 may be deposited on thesubstrate 114 surface. It should be recognized that the precedingdescription pertaining to material types suitable for implementation inone or more showerhead devices 302 of the present invention is not alimitation but merely an illustration as other showerhead materials maybe more or less appropriate in different contexts (e.g., corrosiveresistance, electrical conductivity and etc.).

It is further contemplated that the one or more showerhead devices 302of the system 100 may be located at various distances from the surfaceof the substrate 114. It should be recognized that differentshowerhead-substrate distances may be more or less appropriate indifferent contexts. For instance, when choosing an appropriate distance,the specific liquid material 106 implemented, the flow rate of theliquid material 106, the size of the isolated application region, and avariety of other factors may be considered.

In a further embodiment, the showerhead device 302 may include arotatable showerhead device. It should be recognized by those skilled inthe art that utilizing a rotatable showerhead device provides for moreuniform liquid material spray 122 application on the surface of thesubstrate.

Referring now to FIGS. 4A and 4B, it is further contemplated that ahorizontal liquid application process may be employed by the presentinvention. The horizontal non-contact application system 400 may includean injection element 402 (e.g., an injection bar). For example, a liquidmaterial 107 may be supplied from a liquid material source 106 to aninlet of an injection element 402. The injection element 402 may thenapply a portion of the liquid material 107 by depositing droplets of theliquid material 107 onto the surface of the substrate 114 via aninjection element 402 outlet 403. Further, the horizontal non-contactdeposition system 400 may include a horizontal gas curtain element 406(e.g., gas curtain bar). For example, an inert gas (e.g., nitrogen orargon) may be supplied from an inert gas source to an inlet 405 of thehorizontal gas curtain element 406. The gas curtain element 406 may thenact to contain the applied liquid material 106 by directing a gas flow408 emanating from a curtain element outlet 407 toward the edge of theselected region 108 of liquid material deposition. In addition, thehorizontal non-contact deposition system 400 may include a vacuumelement 404 (e.g., a vacuum bar). For example, the vacuum bar 404 mayact to uptake liquid material 106 that flows from the gas curtainelement 406 and the injection element 402 toward the vacuum bar 404.

Referring now to FIG. 5, a method 500 for combinatorial non-contact wetprocessing is described in accordance with the present disclosure. It iscontemplated that the method described below may be carried oututilizing the system 100 described in the present disclosure. The method500 for combinatorial non-contact wet processing includes providing 502a liquid material 107. Then, the method 500 includes transporting afirst portion 504 of the liquid material 107 from a source of the liquidmaterial 106 to a first reaction cell 102, wherein the first reactioncell 102 is configured for positioning at a first selected distance fromthe surface of a substrate. For example, the first portion of the liquidmaterial 107 may be transported from the liquid material source 106 tothe first reaction cell 102 via the source-cell conduit 104. Next, themethod 500 includes transporting at least a second portion 506 of theliquid material 107 from the source of the liquid material 106 to atleast a second reaction cell 102, wherein the at least a second reactioncell is configured for positioning at a second selected distance fromthe surface of a substrate. Then, the method 500 includes converting thefirst portion 508 of the liquid material 107 to a first atomized sprayof liquid particles. For example, a plurality of gas jets 110 disposedwithin the interior of a reaction cell 102 may be utilized to convertthe liquid material 107 into a first spray of liquid material 122. Next,the method 500 includes converting the at least a second portion 510 ofthe liquid material 107 to at least a second atomized spray of liquidparticles 122. Then, the method 500 includes containing a portion of thefirst atomized spray 512 of liquid particles within a first selectedregion 108 of the substrate 114. For example, a vacuum element 127 maybe utilized to contain the first liquid material within a first selectedregion 108 of the substrate. Next, the method 500 includes containing aportion of the at least a second atomized spray 514 of liquid particleswithin at least a second selected region of the substrate. Similarly, avacuum element 127 may be utilized to contain the second spray of liquidmaterial within a second selected region 108 of the substrate. Then, themethod 500 includes applying 516 a portion of the first atomized sprayof particles onto the first selected region of the substrate. Next, themethod includes applying a portion of the at least a second atomizedspray of particles onto the at least a second selected region of thesubstrate.

Those having skill in the art will recognize that the state of the arthas progressed to the point where there is little distinction leftbetween hardware and software implementations of aspects of systems; theuse of hardware or software is generally (but not always, in that incertain contexts the choice between hardware and software can becomesignificant) a design choice representing cost vs. efficiency tradeoffs.Those having skill in the art will appreciate that there are variousvehicles by which processes and/or systems and/or other technologiesdescribed herein can be effected (e.g., hardware, software, and/orfirmware), and that the preferred vehicle will vary with the context inwhich the processes and/or systems and/or other technologies aredeployed. For example, if an implementer determines that speed andaccuracy are paramount, the implementer may opt for a mainly hardwareand/or firmware vehicle; alternatively, if flexibility is paramount, theimplementer may opt for a mainly software implementation; or, yet againalternatively, the implementer may opt for some combination of hardware,software, and/or firmware. Hence, there are several possible vehicles bywhich the processes and/or devices and/or other technologies describedherein may be effected, none of which is inherently superior to theother in that any vehicle to be utilized is a choice dependent upon thecontext in which the vehicle will be deployed and the specific concerns(e.g., speed, flexibility, or predictability) of the implementer, any ofwhich may vary. Those skilled in the art will recognize that opticalaspects of implementations will typically employ optically-orientedhardware, software, and or firmware.

Those skilled in the art will recognize that it is common within the artto describe devices and/or processes in the fashion set forth herein,and thereafter use engineering practices to integrate such describeddevices and/or processes into data processing systems. That is, at leasta portion of the devices and/or processes described herein can beintegrated into a data processing system via a reasonable amount ofexperimentation. Those having skill in the art will recognize that atypical data processing system generally includes one or more of asystem unit housing, a video display device, a memory such as volatileand non-volatile memory, processors such as microprocessors and digitalsignal processors, computational entities such as operating systems,drivers, graphical user interfaces, and applications programs, one ormore interaction devices, such as a touch pad or screen, and/or controlsystems including feedback loops and control motors (e.g., feedback forsensing position and/or velocity; control motors for moving and/oradjusting components and/or quantities). A typical data processingsystem may be implemented utilizing any suitable commercially availablecomponents, such as those typically found in datacomputing/communication and/or network computing/communication systems.

The herein described subject matter sometimes illustrates differentcomponents contained within, or connected with, different othercomponents. It is to be understood that such depicted architectures aremerely exemplary, and that in fact many other architectures can beimplemented which achieve the same functionality. In a conceptual sense,any arrangement of components to achieve the same functionality iseffectively “associated” such that the desired functionality isachieved. Hence, any two components herein combined to achieve aparticular functionality can be seen as “associated with” each othersuch that the desired functionality is achieved, irrespective ofarchitectures or intermedial components. Likewise, any two components soassociated can also be viewed as being “operably connected”, or“operably coupled”, to each other to achieve the desired functionality,and any two components capable of being so associated can also be viewedas being “operably couplable”, to each other to achieve the desiredfunctionality. Specific examples of operably couplable include but arenot limited to physically mateable and/or physically interactingcomponents and/or wirelessly interactable and/or wirelessly interactingcomponents and/or logically interacting and/or logically interactablecomponents.

While particular aspects of the present subject matter described hereinhave been shown and described, it will be apparent to those skilled inthe art that, based upon the teachings herein, changes and modificationsmay be made without departing from the subject matter described hereinand its broader aspects and, therefore, the appended claims are toencompass within their scope all such changes and modifications as arewithin the true spirit and scope of the subject matter described herein.

Furthermore, it is to be understood that the invention is defined by theappended claims. It will be understood by those within the art that, ingeneral, terms used herein, and especially in the appended claims (e.g.,bodies of the appended claims) are generally intended as “open” terms(e.g., the term “including” should be interpreted as “including but notlimited to,” the term “having” should be interpreted as “having atleast,” the term “includes” should be interpreted as “includes but isnot limited to,” etc.). It will be further understood by those withinthe art that if a specific number of an introduced claim recitation isintended, such an intent will be explicitly recited in the claim, and inthe absence of such recitation no such intent is present. For example,as an aid to understanding, the following appended claims may containusage of the introductory phrases “at least one” and “one or more” tointroduce claim recitations. However, the use of such phrases should notbe construed to imply that the introduction of a claim recitation by theindefinite articles “a” or “an” limits any particular claim containingsuch introduced claim recitation to inventions containing only one suchrecitation, even when the same claim includes the introductory phrases“one or more” or “at least one” and indefinite articles such as “a” or“an” (e.g., “a” and/or “an” should typically be interpreted to mean “atleast one” or “one or more”); the same holds true for the use ofdefinite articles used to introduce claim recitations. In addition, evenif a specific number of an introduced claim recitation is explicitlyrecited, those skilled in the art will recognize that such recitationshould typically be interpreted to mean at least the recited number(e.g., the bare recitation of “two recitations,” without othermodifiers, typically means at least two recitations, or two or morerecitations). Furthermore, in those instances where a conventionanalogous to “at least one of A, B, and C, etc.” is used, in generalsuch a construction is intended in the sense one having skill in the artwould understand the convention (e.g., “a system having at least one ofA, B, and C” would include but not be limited to systems that have Aalone, B alone, C alone, A and B together, A and C together, B and Ctogether, and/or A, B, and C together, etc.). In those instances where aconvention analogous to “at least one of A, B, or C, etc.” is used, ingeneral such a construction is intended in the sense one having skill inthe art would understand the convention (e.g., “a system having at leastone of A, B, or C” would include but not be limited to systems that haveA alone, B alone, C alone, A and B together, A and C together, B and Ctogether, and/or A, B, and C together, etc.). It will be furtherunderstood by those within the art that virtually any disjunctive wordand/or phrase presenting two or more alternative terms, whether in thedescription, claims, or drawings, should be understood to contemplatethe possibilities of including one of the terms, either of the terms, orboth terms. For example, the phrase “A or B” will be understood toinclude the possibilities of “A” or “B” or “A and B.”

Although particular embodiments of this invention have been illustrated,it is apparent that various modifications and embodiments of theinvention may be made by those skilled in the art without departing fromthe scope and spirit of the foregoing disclosure. Accordingly, the scopeof the invention should be limited only by the claims appended hereto.

It is believed that the present disclosure and many of its attendantadvantages will be understood by the foregoing description, and it willbe apparent that various changes may be made in the form, constructionand arrangement of the components without departing from the disclosedsubject matter or without sacrificing all of its material advantages.The form described is merely explanatory, and it is the intention of thefollowing claims to encompass and include such changes.

What is claimed:
 1. A method for non-contact wet processing, the methodcomprising: positioning a reaction cell a distance from a surface of asubstrate; transferring a liquid to an interior of the reaction cell;atomizing the liquid transferred to the interior of the reaction cell;evacuating portions of the liquid along an entire periphery of thereaction cell such that the liquid material that remains on the surfaceof the substrate is contained within a selected region of the surface ofthe substrate; and flowing gas along the entire periphery of thereaction cell to further contain the liquid within the selected regionof the surface of the substrate.
 2. The method of claim 1, wherein theatomizing of the liquid transferred to the interior of the reaction cellis performed by a plurality of gas jets disposed within the interior ofthe reaction cell.
 3. The method of claim 1, wherein the evacuating ofthe portions of the liquid along the entire periphery of the reactioncell is performed with at least one vacuum element disposed along theentire periphery of the reaction cell.
 4. The method of claim 1, whereinthe flowing of the gas along the entire periphery of the reaction cellis performed with at least one gas curtain element.
 5. The method ofclaim 4, wherein the at least one gas curtain element comprises a gascurtain ring disposed along a circumferential periphery of the reactioncell.
 6. The method of claim 4, wherein the at least one gas curtainelement comprises a gas curtain bar disposed along an edge of thereaction cell.
 7. The method of claim 1, wherein the distance is afunction of a material property of the substrate.
 8. The method of claim1, wherein the distance is a function of a material property of theliquid.
 9. The method of claim 3, wherein the at least one vacuumelement comprises a vacuum ring disposed along a circumferentialperiphery of the reaction cell.
 10. The method of claim 4, wherein theat least one vacuum element comprises a vacuum bar disposed along anedge of the reaction cell.
 11. A method for combinatorial non-contactwet processing, the method comprising: positioning a first reaction cella first distance from a surface of a substrate; position a secondreaction cell a second distance from the surface of the substrate;transferring a liquid to an interior of the first reaction cell and aninterior of the second reaction cell; atomizing the liquid transferredto the interior of the first reaction cell and the second reaction cell;evacuating portions of the liquid along an entire periphery of the firstreaction cell such that the liquid material that remains on the surfaceof the substrate proximate to the first reaction cell is containedwithin a first selected region of the surface of the substrate; flowinggas along the entire periphery of the first reaction cell to furthercontain the liquid within the first selected region of the surface ofthe substrate; evacuating portions of the liquid along an entireperiphery of the second reaction cell such that the liquid material thatremains on the surface of the substrate proximate to the second reactioncell is contained within a second selected region of the surface of thesubstrate; and flowing gas along the entire periphery of the secondreaction cell to further contain the liquid within the second selectedregion of the surface of the substrate.
 12. The method of claim 11,wherein the atomizing of the liquid transferred to the interior of thefirst reaction cell and the interior of the second reaction cell isperformed by a plurality of gas jets disposed within the interior of thefirst reaction cell and the second reaction cell.
 13. The method ofclaim 11, wherein the evacuating of the portions of the liquid along theentire periphery of the first reaction cell is performed with at leastone first vacuum element disposed along the entire periphery of thefirst reaction cell, and wherein the evacuating of the portions of theliquid along the entire periphery of the second reaction cell isperformed with at least one second vacuum element disposed along theentire periphery of the second reaction cell.
 14. The method of claim11, wherein the flowing of the gas along the entire periphery of thefirst reaction cell is performed with at least one first gas curtainelement, and wherein the flowing of the gas along the entire peripheryof the second reaction cell is performed with at least one second gascurtain element.
 15. The method of claim 14, wherein the at least onefirst gas curtain element comprises a first gas curtain ring disposedalong a circumferential periphery of the first reaction cell, andwherein the at least one second gas curtain element comprises a secondgas curtain ring disposed along a circumferential periphery of thesecond reaction cell.
 16. A method for combinatorial non-contact wetprocessing, comprising: providing a liquid material; transporting afirst portion of the liquid material from a source of the liquidmaterial to a first reaction cell, wherein the first reaction cell isconfigured for positioning at a first selected distance from the surfaceof a substrate; transporting at least a second portion of the liquidmaterial from the source of the liquid material to at least a secondreaction cell, wherein the at least a second reaction cell is configuredfor positioning at a second selected distance from the surface of asubstrate; converting the first portion of the liquid material to afirst atomized spray of liquid particles; converting the at least asecond portion of the liquid material to at least a second atomizedspray of liquid particles; containing a portion of the first atomizedspray of liquid particles within a first selected region of thesubstrate; containing a portion of the at least a second atomized sprayof liquid particles within at least a second selected region of thesubstrate; applying a portion of the first atomized spray of particlesonto the first selected region of the substrate; and applying a portionof the at least a second atomized spray of particles onto the at least asecond selected region of the substrate.
 17. The method forcombinatorial non-contact wet processing of claim 16, wherein theconverting the first portion of the liquid material to a first atomizedspray of liquid particles comprises: converting a portion of the liquidmaterial to an atomized spray of liquid particles via two or more gasjets disposed within an interior of a reaction cell.
 18. The method forcombinatorial non-contact wet processing of claim 16, wherein thecontaining a portion of the first atomized spray of liquid particleswithin a first selected region of the substrate comprises: containing aportion of the first atomized spray of liquid particles within a firstselected region of the substrate via a vacuum element disposed on theperiphery of a reaction cell.
 19. The method for combinatorialnon-contact wet processing of claim 16, wherein the containing a portionof the first atomized spray of liquid particles within a first selectedregion of the substrate comprises: containing a portion of the firstatomized spray of liquid particles within a first selected region of thesubstrate via a gas curtain element disposed on the periphery of areaction cell.
 20. The method for combinatorial non-contact wetprocessing of claim 16, wherein the transporting a first portion of theliquid material from a source of the liquid material to a first reactioncell comprises: transporting a first portion of the liquid material froma source of the liquid material to a liquid inlet of a first reactioncell.